Zymet Introduces CN-1735 Underfill Print E-mail
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Written by Chelsey Drysdale   
Wednesday, 12 February 2014 16:09

CN-1735 underfill is designed to enhance thermal cycle performance of IC packages with pitches as fine as 0.3mm. Reportedly enhances ruggedness for drop and bend test performance. Has a CTE of 40 ppm/°C. Reportedly can be reworked using elevated temperature (170°C to 180°C) to remove underfill fillet.

Zymet, www.zymet.com

 

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