| MEK Delivers S-1 Solder Paste Inspection |
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| Written by Chelsey Drysdale | |||
| Friday, 02 March 2012 11:42 | |||
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S-1 solder paste inspection system has GR&R less than 5%, fast scan speeds, and excellent accuracy. Uses 3D+2D technologies and both white light and laser imaging. Interfaces with a range of solder paste printers to automatically correct print parameters on the fly; can interface with pick-and-place systems. MEK, www.escapethegreyworld.com
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535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....
