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What will be the impact of Orbotech leaving the AOI market?
  
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 Date Item Title
Wednesday, 06 August 2008 Cookson Rolls Out Alpha PoP-959 Pb-Free Solder Paste
Wednesday, 06 August 2008 Techspray Introduces Turbo-Coat Acrylic Conformal Coating
Wednesday, 06 August 2008 FocalSpot Debuts FA-Inspector Desktop AOI
Wednesday, 06 August 2008 SchmartBoard Develops SchmartSolder
Wednesday, 06 August 2008 RMD Adds Feature to LeadTracer-RoHS
Wednesday, 06 August 2008 Kester Offers Kester 295 No-Clean Flux
Tuesday, 05 August 2008 Christopher Introduces KDS-101 Solder Dross Recovery System
Monday, 04 August 2008 Aqueous Releases Trident III Automatic Defluxing System
Thursday, 31 July 2008 High-Tech Conversions Premiers Pink ESD Wipes
Thursday, 31 July 2008 Sealant Rolls Out See-Flo 202 Meter-Mix Dispense System
Wednesday, 30 July 2008 Henkel Offers Ablestik 8000 Wafer Backside Coating
Wednesday, 30 July 2008 Aqueous Debuts SMT3000LD Automatic Defluxing System
Wednesday, 30 July 2008 FCT Solder Introduces WS170 Solder Paste
Friday, 25 July 2008 Desco Introduces ESD Tape Dispenser
Friday, 25 July 2008 Kester Offers 295 No-Clean Flux
Friday, 25 July 2008 Icon Upgrades Icon i8 Screen Printer
Thursday, 24 July 2008 Virtual Industries Launches TV-1000 Vacuum-Tweezer
Thursday, 24 July 2008 BTU Updates Pyramax Reflow Oven
Wednesday, 23 July 2008 BPM Upgrades Flashstream
Tuesday, 22 July 2008 Mixpac Rolls Out DX Dispensing Series
Tuesday, 22 July 2008 Lord Corp. Introduces 5W, 6W High-Conductivity Thermal Greases
Tuesday, 22 July 2008 Lord Releases ME-542 Thermally Conductive Flip Chip Underfill
Tuesday, 22 July 2008 Lord Offers Gelease Material
Tuesday, 22 July 2008 Lord Develops Non-Silicone Thermal Die Lid Attach
Monday, 21 July 2008 Smart Sonic Rolls Out Series 500 Stencil Cleaners
Monday, 21 July 2008 DownStream Releases BluePrint for PCBs Version 2.0
Wednesday, 16 July 2008 FKN Systek Introduces K4000 Motorized Linear Blade Depanelizer
Tuesday, 15 July 2008 Agilent Releases Aerospace/Defense Symposium on CD
Tuesday, 15 July 2008 Manncorp Offers Hi Output Line
Monday, 14 July 2008 ECT Presents ZIP Contacts
Monday, 14 July 2008 Asymtek Debuts DispenseJet DJ-9500
Friday, 11 July 2008 Data I/O Launches ProLINE-RoadRunner XLF
Wednesday, 09 July 2008 Heraeus Designs PC3200 Conductive Adhesives
Wednesday, 09 July 2008 YESTech Introduces Upgraded YTV F1 Series AOI
Tuesday, 08 July 2008 Dage Announces Enhanced 4000HS High-Speed Bondtester
Monday, 07 July 2008 Zestron Rolls Out Zestron DS 100 Defluxer
Monday, 07 July 2008 KIC Releases KIC Explorer 9
Wednesday, 02 July 2008 Nordson Offers e.dot+ Hot Melt Guns
Monday, 30 June 2008 Aegis Releases Data Miner 2.0
Monday, 30 June 2008 Blue Thunder Introduces Nitrile Glove
Monday, 30 June 2008 Practical Components Supplies FusionQuad Dummy Component
Friday, 27 June 2008 Technic Releases TechniShield Metallization Process
Thursday, 26 June 2008 Sealant Launches 2200-545 Series Valves
Wednesday, 25 June 2008 Hesse & Knipps Presents Bondjet BJ820 Wedge Bonder
Monday, 23 June 2008 Cytec Introduces Conap Conathane EN-3010 Potting Compound
Wednesday, 18 June 2008 Henkel Redesigns Technomelt Hot Melt Packaging
Wednesday, 18 June 2008 Practical Components Announces Amkor 15 MMM Dummy PoP
Tuesday, 17 June 2008 Cookson Launches ‘First-Time-Right’ NPI Stencils Initiative
Monday, 16 June 2008 Manncorp Unveils Model 5500 Benchtop Stencil Printer
Monday, 16 June 2008 FKN Systek Releases K7000 Depanelizer
 
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The CA Blog - Musings on Electronics Assembly
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