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SAN JOSE - Outsourcing of IC packaging assembly has fully
resumed as unit growth reached double-digits the past three years. Contractors
will continue to inherit a growing percentage of the IC packaging business as semiconductor
manufacturers focus on the front end.
That's
according to Electronic Trend Publications, a San Jose-based research
firm. In a just released report, "The Worldwide IC Packaging Market," ETP finds
that the worldwide IC market grew 28% in
2004 to $179 billion - surpassing the 2000 peak of $177 billion. IC units hit
105 billion, up 53% since 2001.
The firm says unit growth
will ease this year, in line with past performance in which high unit growth has
topped out after three consecutive years. Solid unit growth should return in
2006-2008 before softening in 2009.
ETP forecasts shipments will
grow from 105 billion units in 2004 to 164 billion units in 2009, a compound
annual growth rate of 9.3%. IC revenue growth should nearly equal unit growth,
the firm says.
A
total of 33.7 billion ICs were assembled
by contractors in 2004, an increase of nearly 40% year-on-year. Contractors
assembled 32% of the world total, up 5.3 points from 2003, and will reach 37%
by 2009, ETP says.
Package Unit Growth, 2004-09
|
|
2004
|
2005
|
2006
|
2007
|
CAGR
(%)*
|
|
DIP
|
7.5
|
7.4
|
8.0
|
8.5
|
4.4
|
|
SOT
|
12.4
|
12.5
|
13.0
|
14.0
|
4.3
|
|
SO
|
30.0
|
30.0
|
32.8
|
35.7
|
5.4
|
|
TSOP
|
13.7
|
13.8
|
15.2
|
16.1
|
4.8
|
|
DFN
|
1.5
|
1.9
|
2.7
|
3.5
|
29.6
|
|
CC
|
1.7
|
1.7
|
1.9
|
2.0
|
5.2
|
|
QFP
|
11.6
|
11.6
|
12.9
|
14.5
|
7.0
|
|
QFN
|
3.4
|
4.3
|
5.8
|
7.8
|
25.2
|
|
PGA
|
0.35
|
0.037
|
0.41
|
0.50
|
8.4
|
|
BGA
|
4.4
|
4.9
|
5.8
|
6.8
|
12.6
|
|
FBGA/DSBGA
|
7.6
|
8.6
|
10.8
|
13.4
|
18.4
|
|
WLP
|
3.5
|
4.1
|
5.5
|
7.1
|
23.4
|
|
DCA
|
7.7
|
8.3
|
9.5
|
11.0
|
11.2
|
|
Total
|
105.2
|
109.0
|
124.1
|
140.7
|
9.3%
|
Source: ETP. Units
in billions. Numbers rounded. *Through 2009.
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