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BANNOCKBURN, IL – A group of leading solder vendors today
issued a statement asserting “no evidence” exists demonstrating voiding has “any
significant impact” on solder joint reliability.
In a
statement, Karl Seelig, chair of the subcommittee that issued the report, stressed
its findings on Pb- free voids. “Based on the comparison of the number and size
of solder joint voids to thermal cycle interconnection failure date, there is
no evidence that solder joint voiding has any significant impact on solder
joint reliability."
The report
was issued three months ago by the Solder Products Value Council, a group of
vendors organized under IPC.
The research
is based on results of a three-year, $1 million test program that studied the reliability
of tin-silver-copper alloys.
The research
further determined no difference in reliability between the SAC alloy family. In
the report, an alloy comprised of SnAg3.0Cu0.5 was recommended.
Seelig said the
group compiled “excellent data” on the effects of solder joint voids on solder
joint reliability for SAC alloys.
The group is
making a public statement now because significant details over the much-debated
Pb-free voiding might have been lost in the overall scope of the report, Seelig
said, “That’s the reason the council has published a special report
specifically on solder joint voids for Pb-free solder. We have the data and it
was only a matter of reformatting it for easier analysis.”
The report is
available to IPC members and can be obtained through the SPVC technical subcommittee.
The SVPC is made
up of AIM, Kester, Advanced Metals
Technology, Avantec, Cookson Electronics, EFD, Henkel, Heraeus, Koki Co.,
Metallic Resources Inc., Nihon Superior, P. Kay Metal Supply, Qualitek, Mitsui
Comtek Corp., Shenmao Technology Inc., Thai Solder Industry Corp. and Indium Corp.
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