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Manncorp Releases Auto Dip |
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Written by Chelsey Drysdale
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Monday, 12 November 2007 |
Auto Dip is a compact semiautomatic Pb-free solder dipping machine, reportedly capable of processing a single board or pallets of up to 490 mm x 320 mm in 2 to 12 sec. Boards are placed on a fixtureless ultra-fine needle bed, which is said to retain PCBs without components being dislodged when dipped into the solder bath. Solder is applied while surface tension “floats” the boards at wetting height. Activation is controlled by microprocessor at adjustable intervals, or by foot pedal. A built-in motorized skimmer removes dross as needed. Adjustments exist for dwell time, temperature from 220º to 299 Cº, and dipping angle. Startup and shutdown times are controllable and can be preset for up to one week.
Manncorp, www.manncorp.com
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