Circuits Assembly - Cobar Rolls Out XF3 Pb-Free Solder Paste

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Cobar Rolls Out XF3 Pb-Free Solder Paste

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Cobar Rolls Out XF3 Pb-Free Solder Paste

Written by Chelsey Drysdale
Friday, 08 February 2008
XF3 Pb-free solder paste reportedly accommodates extended reflow profiles without use of nitrogen. Is based on patented SN100C alloy, which reportedly has demonstrated long-term fatigue strength over silver-containing SAC-alloys. Is said to remedy copper migration into tin regions of the solder joint. Wetting on all common metal surfaces is said to be excellent. Prints at 150-200-mm per sec. Cobar Europe, www.cobar.com

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