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Koh Young Releases KY-8030 SPI Print E-mail
Written by Chelsey Drysdale   
Monday, 11 February 2008
The KY-8030 inline solder paste inspection system is for high-mix/low-volume applications. Incorporates optical and image processing technology and feedback tools. Uses full parametric inspection algorithms. Is said to deliver results based on 100% inspection of every paste deposit. Reportedly programs in fewer than 15 min.
 
Koh Young Technology/Christopher Associates, www.christopherweb.com
 
 

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