Circuits Assembly - Interplex Reveals Press-Fit, Solderless Technology

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Interplex Reveals Press-Fit, Solderless Technology

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Interplex Reveals Press-Fit, Solderless Technology

Written by Chelsey Drysdale
Wednesday, 27 February 2008
Press-Fit, Solderless Interconnect Technology permits assembly of a terminal or electrical lead with a plated through-hole to create a solderless electrical connection. Reportedly is fully tested to meet operating requirements, and has passed standard automotive testing requirements for vibration and for temperatures up to 125°C. Material thicknesses for eye-of-the-needle-based press fit designs are 0.64 and 0.80 mm. Interplex Industries, www.interplex.com

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