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YESTech Introduces X3 3-D X-Ray Inspection

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YESTech Introduces X3 3-D X-Ray Inspection

Written by Chelsey Drysdale
Thursday, 28 February 2008
The YTX X3 3-D x-ray inspection system is for PCBs with BGAs and other hidden solder joints. Proprietary imaging technology gathers oblique images to construct a 3-D rendering used to identify solder and component-related defects on both single and double-sided boards. Selectively uses 2-D or 3-D to inspect specific regions on a board. Programming is said to be fast and intuitive, with a typical complete inspection program created in fewer than 30 min. Is suited for in- or offline applications and reportedly offers fast throughput and low false calls. Included are remote programming and real-time SPC software. YESTech Inc., www.yestechinc.com

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