Hysol FF6000 reflow-cured encapsulant material combines flux functionality and underfill protection. Is formulated to provide flux for Pb-free solder joint formation. When cured, reportedly delivers protection against mechanical stress. Bottom-side spheres are dipped prior to component placement; device is placed onto PCB or substrate, and then travels through reflow. Flux provides action necessary for solder joint formation, and the epoxy encapsulates each solder sphere. Is said to eliminate the need for dispensing equipment and the time required for underfill application and cure. Is suited for package-on-package device configurations and large BGAs and CSPs.

Henkel, www.henkel.com/electronics