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Palomar Microelectronics Expands Assembly Capacity |
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Written by Mike Buetow
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Thursday, 17 April 2008 |
CARLSBAD, CA -- Palomar Microelectronics has tripled the size of its cleanroom assembly space and increased its prototyping, applications engineering, process development, assembly, and test services capabilities.
The company, a unit of Palomar Technologies, opened 2,500 sq. f. class 100K and 500 sq. ft. class 10K cleanrooms, said to enable rapid prototyping and turnaround of advanced wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids.
“The new cleanroom space allows us to provide microelectronic services for many of the emerging technologies in areas such as MEMS, high bright LEDs, and other advanced packaging applications and to speed delivery of these services to our customers,” said Donald Beck, operations manager for Palomar Microelectronics.
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