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Written by Chelsey Drysdale
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Friday, 18 April 2008 |
BANNOCKBURN, IL – IPC has released IPC-7095B, Design and Assembly Process Implementation for BGAs.
This revised document focuses on applications that use both SnPb and Pb-free on the same board, including various solder ball alloys, new laminate materials for Pb-free, BGA trace escape and routing considerations during board design to improve yield and reduce cost,” explained Ray Prasad, task group chairman.
“There is also a detailed discussion of reflow solder profiling, void process indicators and ways to improve product reliability,” he said
The standard was approved by consensus last month, said Prasad, who is also principal of Ray Prasad Consultancy Group, in a statement.
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