Circuits Assembly - IPC Revises BGA Spec

News

IPC Revises BGA Spec

You must be registered to access the full content of this site.
To Register, Click Here

Part Search

Poll

Latest News
iSuppli Slashes 2009 PC Forecast Plexus Purchases Facility in Greenville, WI Samsung's TV Plant Back to Full Ops Northstar's Revenues Continue Fall Raven Reports Q3 Sales Up 22% YoY

IPC Revises BGA Spec

Written by Chelsey Drysdale
Friday, 18 April 2008
BANNOCKBURN, IL – IPC has released IPC-7095B, Design and Assembly Process Implementation for BGAs. This revised document focuses on applications that use both SnPb and Pb-free on the same board, including various solder ball alloys, new laminate materials for Pb-free, BGA trace escape and routing considerations during board design to improve yield and reduce cost,” explained Ray Prasad, task group chairman. “There is also a detailed discussion of reflow solder profiling, void process indicators and ways to improve product reliability,” he said The standard was approved by consensus last month, said Prasad, who is also principal of Ray Prasad Consultancy Group, in a statement.

The CA Blog - Musings on Electronics Assembly

A View of the Orb
Orbotech’s announcement Monday — somehow missed by all the media save one — that it would exit the assembly AOI…
IPC Hall of Shame
The Consumer Electronics Association this week inducted a dozen persons into its Hall of Fame. That brings the total to…
Goodbye, Sean
I’ve known Sean McShefferty less than a year. I feel like I’ve known him my whole life. Upon our first…
Rust Never Sleeps
Not so long ago, New England was derisively referred to as the Rust Belt,* as manufacturers migrated for the warm…
Give Me Patent Liberty
Nathan Myhrvold is smarter than me, but he still doesn’t get it. Or perhaps just doesn’t want to. Myhrvold, the…

Classifieds
DDi - European Sales Reps South Bay Circuits - Direct Sales & Mfr. Sales Rep EFD, Inc. Solder Paste Group