EDINA, MN – SMTA has issued a call for papers for SMTA China South (Aug. 26-28) and SMTA China North (Nov. 10-11).

These events will be held in conjunction with Nepcon South China and Bohai Electronics Week.

Topics to be covered include 01005 and chip-scale-package assembly; 3D SiP; challenges of PCB fabrication technology and surface finish; component supply integrity; cost reduction initiative; advanced low I/O packaging; flex circuit assembly; market trends in assembly manufacture; manufacturing engineering; materials and process characterization; Pb-free processes and product reliability; package on package; process control excellence; production and supply chain management; RoHS compliance and materials; risk-free rework/repairing, and inspection and failure analysis.

SMTA requests technical papers for the technology or vendor conferences. Papers are requested in both Chinese and English; Chinese presentations are recommended.

The deadline for abstracts for China South is May 15, and for China North, July 10.

Submit abstracts to peggy@smta.org.