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Latest News

May 2008 Issue Print E-mail
Written by Administrator   
Wednesday, 30 April 2008
May 2008 cover

FEATURES

  • Quality Control
    Eliminating Board Defects
    Quality product starts with DfA and the master drawing. But fabricators and assemblers have their place, too.
    By Zulki Khan

  • SEA and NPI Awards
    ‘Inspiration to Innovate’
    The 2008 edition of Circuits Assembly’s Service Excellence Awards was notable for the continuing dominance of Aegis as it was for the ascent of several previously under-the-radar EMS companies who made their mark for the first time. Plus: The NPI Award makes its debut.
    By Chelsey Drysdale

  • Cover Story
    Evaluating Manufacturability and Operational Costs for New Conformal Coating Processes
    Higher density components and smaller footprint layouts make the conformal coating process more challenging in terms of achieving acceptable first-pass process yields and cost-effective cycle times. This study of seven assembly process variables identified the three most critical variables and their impacts.
    By Jason Keeping

FIRST PERSON

MONEY MATTERS

TECH TALK

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Industry News
Market Watch
Product Spotlight
Assembly Insider
Ad Index

On the cover: Novel test procedures and processes demonstrate that comparisons among various cleaning agents, masking materials, coating materials and application equipment can be made. (Photo courtesy Asymtek)


OK International - Soldering Webinar - July 31, 2008
The CA Blog - Musings on Electronics Assembly
Classifieds
Cookson Electronics - ALPHA SACX Lead-Free Wave Solder Alloy
PCB West 2008: September 14-19, Santa Clara Marriott
Metallic Resources - Lead-Free Solder
Cookson Electronics - ALPHA EF-2210 Flux
OK International - Soldering Webinar - July 31, 2008
NEPCON South China/EMT South China - August 27-30, 2008 - Shenzhen, China
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