Circuits Assembly - Balver Zinn Launches XF3 Solder Paste

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Balver Zinn Launches XF3 Solder Paste

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Balver Zinn Launches XF3 Solder Paste

Written by Mike Buetow
Monday, 12 May 2008
XF3 Pb-free solder paste accommodates extended reflow profiles without the use of nitrogen and is based on the patented SN100C alloy. Reportedly wets well to all common metal surfaces. Prints at 150-200 mm/sec, and reduces voiding.\ Balver Zinn, www.balverzinn.com

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