Circuits Assembly - Technic Releases TechniShield Metallization Process

News

Technic Releases TechniShield Metallization Process

You must be registered to access the full content of this site.
To Register, Click Here

Part Search

Poll

Latest News
Daves to Keynote MEPTEC Symposium Virtual PCB Registration Now Open ITW’s Electronics Group Up 15% YoY ACT to Commence Corinth Layoffs Vitronics Relaunches ‘5 Steps’ Seminar in MN

Technic Releases TechniShield Metallization Process

Print

E-mail

Written by Chelsey Drysdale
Friday, 27 June 2008
TechniShield is a plating process for individual shielding of active components. Offers direct plating to the molding compound; is said to create nonporous deposit that eliminates the need for metal caps or lids. Uses novel chemistry to roughen and plate the epoxy molding compound. Is chrome-free. Reportedly maintains excellent adhesion through multiple reflows and produces a pore-free surface. Technic Inc., www.technic.com

The CA Blog - Musings on Electronics Assembly
Give Me Patent Liberty Wage War ‘RoHS 2’ Attention Rising on Carbon ‘Seeing’ the Future

Classifieds
DDi - European Sales Reps South Bay Circuits - Direct Sales & Mfr. Sales Rep EFD, Inc. Solder Paste Group

Copyright © 2005 UP Media Group - This site contains copyrighted material that cannot be reproduced without permission.

Powered by Webtising - Page generation time: 1.271156 seconds ·