Circuits Assembly - Dage Announces Enhanced 4000HS High-Speed Bondtester

News

Dage Announces Enhanced 4000HS High-Speed Bondtester

You must be registered to access the full content of this site.
To Register, Click Here

Part Search

Poll

Latest News
Daves to Keynote MEPTEC Symposium Virtual PCB Registration Now Open ITW’s Electronics Group Up 15% YoY ACT to Commence Corinth Layoffs Vitronics Relaunches ‘5 Steps’ Seminar in MN

Dage Announces Enhanced 4000HS High-Speed Bondtester

Print

E-mail

Written by Chelsey Drysdale
Tuesday, 08 July 2008
The enhanced 4000HS High-Speed Bondtester includes high-speed trigger capture software and a rising table work holder for cold bump pull bondtesting. Provides energy measurements during bondtesting. Is JEDEC-compliant. Dage Precision Industries Inc., www.dage-group.com

The CA Blog - Musings on Electronics Assembly
Give Me Patent Liberty Wage War ‘RoHS 2’ Attention Rising on Carbon ‘Seeing’ the Future

Classifieds
DDi - European Sales Reps South Bay Circuits - Direct Sales & Mfr. Sales Rep EFD, Inc. Solder Paste Group

Copyright © 2005 UP Media Group - This site contains copyrighted material that cannot be reproduced without permission.

Powered by Webtising - Page generation time: 1.309039 seconds ·