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Lord Develops Non-Silicone Thermal Die Lid Attach |
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Written by Chelsey Drysdale
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Tuesday, 22 July 2008 |
This thermal die lid attach adhesive is said to replace using two existing materials, such as a thermal interface material and a lid attach adhesive. Uses non-silicone polymer. Polymer is filled for high conductivity; additives are used to improve material properties. Reportedly shows little or no change in thermal conductivity, as measured by laser flash methods and adhesion, based on shear testing, after 150 cycles under standard reliability testing.
Lord Corp., www.lord.com
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