Circuits Assembly - Lord Offers Gelease Material

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Lord Offers Gelease Material

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Lord Offers Gelease Material

Written by Chelsey Drysdale
Tuesday, 22 July 2008
Gelease material has some cross-linking; reportedly has strength to stay in place and does not pump out. Gel is soft; absorbs movement of surfaces caused by CTE differences of assembled parts. Is built on the same cure chemistry as MG121, but reportedly offers higher conductivity, lower modulus and an improved thermal conductivity value (3.8 W/mK). Was designed for syringe dispensing or stencil printing. Is said to be ideal for automotive and consumer electronics. Lord Corp., www.lord.com

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