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RMD Adds Feature to LeadTracer-RoHS |
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Written by Chelsey Drysdale
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Wednesday, 06 August 2008 |
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A solder analysis and identification feature has been added to the LeadTracer-RoHS XRF system. Is said to accurately identify all solder alloys within minutes. Performs a solder pot analysis, permitting users to track changes. Addresses potential weak links in production chain, including boards for second-side assembly on a non-continuous line; boards taken off-line for inspection and analysis; reflow boards moving to wave or selective soldering; boards split into two batches because of line shortages; boards moving from production to rework areas; boards held for missing parts or for component recovery; components held in rework areas, and components from placement reject trays.
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