Circuits Assembly - CeTaQ Adds Reflow Line Validation to Shuttle Carrier

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CeTaQ Adds Reflow Line Validation to Shuttle Carrier

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CeTaQ Adds Reflow Line Validation to Shuttle Carrier

Written by Mike Buetow
Wednesday, 15 October 2008
CeTaQ Shuttle carrier now offers stability validation of reflow ovens. Is said to control temperature profiles, thus optimizing process control. Records temperatures using seven to 12 thermocouple sensors fixed on small pieces of titanium. The board is sent 20 times through the oven using a standard profile from production. The temperature profile used by the customer is the reference for the measurement. Imports data after each run. Calculates peak temperature, reflow time, soak time, and min/max gradient. CeTaq Americas, www.cetaq.com

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