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Indium Debuts Water-Soluble Pb-Free Paste |
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Monday, 29 November 2004 |
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Indium 3.1 water-soluble lead-free solder paste is said to offer
excellent wetting and printing for fine-pitch applications, and a long
stencil life that virtually eliminates solder paste waste. Resultant
sodler joints are shiny and smooth. Also claims a wide reflow window,
slump resistance, low voiding and low foaming.
www.indium.com
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