| Techcon Systems Introduces TS9000 Series Jet Tech Valve |
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TS9000 Series is a Piezoelectric-driven, non-contact Jet Tech valve. Handles fluid viscosities to 2 million Cps. Produces hundreds of deposits in less than one sec. Has adjustable parameter settings and a variety of nozzle shape and sizes, with different tappet configurations. Features field replaceable spare parts. Applications include jetting silver epoxies for die bonding processes, silicone phosphor in the LED assembly process, underfill in microelectronic package applications on PCBAs, and micro dots of UV adhesive in medical device applications. Is shipped standard with a valve, controller, cables and three nozzle tools. Techcon Systems, www.techconsystems.com |
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| European RoHS Enforcement Explained |
A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market. |
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| Believing Foxconn Means Suspending Belief |
The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down: |
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Features
| Managing Your ESD Program |
The processes are as important as the tools. |
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| SMT Reflow Oven-to-Oven Repeatability |
How to adjust an oven so a single recipe will work across multiple ovens for an individual product. |
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Ultra thin double coated tapes are for bonding and attaching components and assemblies where high dielectric strength is required. REACH and RoHS compatible. Come in polyimide (PI) and polyester...
