Techcon Systems Introduces TS9000 Series Jet Tech Valve Print E-mail

TS9000 Series is a Piezoelectric-driven, non-contact Jet Tech valve. Handles fluid viscosities to 2 million Cps. Produces hundreds of deposits in less than one sec. Has adjustable parameter settings and a variety of nozzle shape and sizes, with different tappet configurations. Features field replaceable spare parts. Applications include jetting silver epoxies for die bonding processes, silicone phosphor in the LED assembly process, underfill in microelectronic package applications on PCBAs, and micro dots of UV adhesive in medical device applications. Is shipped standard with a valve, controller, cables and three nozzle tools.

Techcon Systems, www.techconsystems.com

 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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Products

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