| Unimicron to Manufacture Endicott’s CoreEZ |
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| Friday, 28 March 2008 09:18 | |||
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ENDICOTT, NY – Endicott Interconnect Technologies has entered into a sales and manufacturing agreement under which Unimicron Technology will produce CoreEZ organic substrates. No financial terms were announced. Under terms of the agreement, EI maintains control of design and technical support for CoreEZ. Unimicron will manufacture substrates at one of its Taiwanese facilities. The two companies will handle sales jointly.
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| Last Updated on Friday, 28 March 2008 09:19 |
Columns
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I have mentioned numerous times that the first purpose of RoHS is to help make recycling easier. So RoHS was developed to support WEEE. One would imagine that, in doing this, the EU was primarily concerned with recycling in the EU. |
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Fujiploy Offers Sarcon GR-Tac
Sarcon GR-Tac is a 0.25-mm thick polyester reinforced thermal interface material. Is reportedly easy to install and typically does not require adhesive; ideal for applications where surface space...
Sarcon GR-Tac is a 0.25-mm thick polyester reinforced thermal interface material. Is reportedly easy to install and typically does not require adhesive; ideal for applications where surface space...
