Engineered Material Systems Introduces DE-7826, CE-7826 Encapsulants Print E-mail
User Rating: / 0
PoorBest 
Written by Chelsey Drysdale   
Tuesday, 21 February 2012 12:19

DE-7826 (dam) and CE-7826 (fill) dam and fill chip encapsulants are for chip-on-board applications. Are designed to protect wire bonds and reduce stresses associated with thermal cycling. Are engineered to withstand circuit board reliability test criteria. Have thermal expansion coefficients in the 20ppm range when measured by thermal mechanical analysis. Have high glass transition temperatures and modulus to retain low expansion properties throughout operating temperature range of the circuit board. Meet standards for ionic cleanliness.

Engineered Material Systems, www.conductives.com

 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

Read more...
 
The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

Read more...
 

Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

Read more...
 
Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...