| Omnify v. 3.0 PLM Helps Meet RoHS Compliance |
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| Written by Robin Norvell | |||
| Wednesday, 14 June 2006 11:11 | |||
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Omnify 3.0 enables efficient collaboration in product development and helps companies meet RoHS compliance. Meets compliance objectives for such companies as LuminentOIC, Agfa and Mangrove Systems. The newest version provides a means of identifying the complete material composition of a part. It classifies compliant and non-compliant parts, provides searching and reporting features, and performs analysis at any level of a product’s structure. Allows manufacturers to store all of the materials declarations/certificates of compliance from suppliers. Incorporates customer-requested enhancements that accelerate and streamline product development. Customers can achieve faster performance in searching, bill of material loading and engineering change releases in addition to easier importing and exporting of data through XML capabilities. Improvements include: Accelerated performance for faster BOM loading, saving, releasing changes and searching; Vendor part composition fields allowing unlimited vendor attributes; Enhanced permissions offering extended field/attribute and project level permissions; Improved document vaulting and new caching options; Attribute Groups for easy field navigation; New BOM fields including: balloon/find numbers, alternate items fields and user-defined attribute fields; Condition-based dynamic workflows to define generic workflows/stages and user assignments based on various field parameters; XML file formats enabling easy importing and exporting of item and database schema information. Omnify Software, www.omnifysoft.com
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Columns
| No Main Point |
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Products
Young Jin Features Link Conveyors
Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has...
Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has...


