July 2005 Issue Print E-mail
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Thursday, 30 June 2005 19:00

July 2005 cover

FEATURES

  • Process Improvement
    Reducing BGA Defects with AXI Inspection
    How large can a BGA void be and still be considered acceptable? This study established the ideal sensitivity setting for catching BGA voids.
    Zhen (Jane) Feng, Ph.D., Eduardo Toledo, Jonathan Jian and Murad Kurwa

  • ROHS Compliance
    RoHS and the Supply Chain
    The time is at hand to switch to lead-free parts. What are the issues involved?
    Chris Reynolds

  • IC Testing
    The Basics of Boundary Scan
    Eliminate ICT and functional test while reusing test data.
    Stefan Meissner

  • Ag Solderability
    Wetting Characteristics of Pb-Free Alloys of Interest
    Regardless of flux, silver-containing alloys can achieve acceptable wetting at high temperatures.
    Anna Lifton, Ronald A. Bulwith and Louis M. Picchione

  • Cover Story
    Stencil Design for Pb-Free SMT Assembly
    The new process will require a few tweaks from SnPb standards.
    Chrys Shea

  • Optical Inspection
    Pb-Free Flip Chip and CSP Inspection
    A review of failure analysis data for area arrays used in Pb-free soldering shows topside ball delamination that x-ray alone cannot detect. A new nondestructive optical inspection technology can, however.
    Mark Cannon and Juergen Friedrich

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On the cover: "Homeplate" apertures will be replaced by a variety of new designs. (David Gilder)

Last Updated on Saturday, 13 October 2012 08:10
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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Products

KIC Debuts K2 Thermal Profiler
K2 thermal profiler has plug-and-play hardware and a graphical user interface said to make profiling both quick and easy. Enables each thermocouple to use its own unique process window, while...