November 2005 Issue Print E-mail
User Rating: / 0
PoorBest 
Written by Administrator   
Monday, 31 October 2005 19:00

November 2005 cover

FEATURES

  • IR Rework
    A Novel IR Rework System
    Lead-free raises the reworked board temperature – and increases risk of frying other parts. Dynamic temperature control and sensors help manage the heat.
    Mark Cannon

  • Cover Story
    Mixed Technology Gets Selective
    Through-hole is still a fundamental processing step – most boards today mix SMT and PTH technology. Selective and fountain soldering can reduce skips and opens over traditional wave processes. Here's a primer.
    Scott Buttars

  • Academic Research
    Program for Calculation of Flip-Chip Standoff Height
    A simple Visual Basic file easily calculates bump heights and predicts flip-chip standoff gaps.
    Joshua Ampofo, Richard LaBennett, S. Akwaboa and Dr. F. Ferguson

  • Pb-Free Transition
    Switching to Pb-Free: Wave Soldering
    How to adjust conveyors, pots, preheaters and solder modules for Pb-free processes.
    Markus Walter

  • AOI
    Zero-Defect IC Inspection
    What role does camera view play in catching potential defects? The advantages and disadvantages of inspections performed with orthogonal and inclined cameras.
    Peter Krippner

  • Backend Processes
    0.1 Cent RFID Chip Assembly?
    While the world argues over the "nickel tag," the pursuit is on for technologies that would slash manufacturing costs.
    Hugo Pristauz

FIRST PERSON

MONEY MATTERS

TECH TALK

DEPARTMENTS

Industry News
Market Watch
Assembly Insider
Ad Index
Product Spotlight
Classifieds

On the cover: Selective soldering is gaining momentum for PTH processing. (Photo courtesy Juki Automation Systems)


blog comments powered by Disqus
Last Updated on Tuesday, 07 February 2012 09:47
 

Columns

Semblant Warms to New Fluoroolymer Conformal Coating

Months after hinting at a new conformal coating during a paper session at SMTA International, Semblant has officially launched PlasmaShield. CIRCUITS ASSEMBLY editor in chief Mike Buetow spoke with vice president of worldwide sales and marketing Steve McClure last week.

Read more...
 
ECTC in Las Vegas

What happens in Las Vegas at ECTC, doesn’t stay in Las Vegas, it is shared here.

This year’s ECTC, or electronics components technology conference, was held in Las Vegas’ Cosmopolitan, May 28-31.

Read more...
 

Features

The Impact of Reel Splicing Kits on Setup and Changeover

Traditional feeder setup using tape-and-reel can drain time. There’s a quick and better way.

Read more...
 
Standard Solar Cells vs. Next-Gen Cells: Which is Winning?

Overcapacity is stalling the rate of improvement, but only for so long.

Read more...
 

Search

Search

Login

CB Login

Language

Language

English French German Italian Portuguese Russian Spanish
 

Products

GÖPEL Upgrades TOM AOI for Conformal Coatings
TOM system (Teachable Optical Measurement) inline AOI has been enhanced for inspection of conformal coating Maximum PCB size 460 x 400mm. Can be adjusted to specific test requirements. Range of...