January 2009 Issue Print E-mail
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Wednesday, 31 December 2008 19:00
January 2009 cover
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FEATURES

  • The Hidden Factory
    Eliminating Muda: One Company’s Journey
    When the Milwaukee Electronics Companies decided to implement Lean manufacturing principles in 2003, its implementation team thought the major benefit would be increased throughput on the manufacturing floor. While those goals were achieved, the most significant lesson learned was the true bottleneck lay in supply-chain management.
    By Don Sivilotti

  • Cover Story
    Selective Wave Soldering DoE to Develop DfM Guidelines for Lead and Pb-Free Assemblies
    The reduced pallet opening size on a selective wave solder pallet hampers the ability to successfully fill PTH barrels, a problem amplified when using Pb-free alloy due to differences in fluid properties. An intensive DoE finds several ways to quantify the impact of design, component spacing and hole-fill criteria in terms of DPMO.
    By Makram Boulos, Craig Hamilton, Mario Moreno, Ramon Mendez, German Soto and Jessica Herrera

  • Test Developments
    Overcoming Limited Access at ICT
    A new novel technology delivers in-circuit test stimulus signals via a boundary scan device, a method said to reduce the number of ICT probes needed to test all the board components – and the ICT system cost, too.
    By Jun Balangue

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On the cover: A DoE offers optimized solder pallet designs for selective soldering. (Photo courtesy Celestica)

Last Updated ( Tuesday, 05 May 2009 06:08 )
 

Columns

No Main Point

Check out this exchange from Jabil's recent quarterly conference call:

Alexander Blanton (Ingalls & Snyder analyst): [Y]ou mentioned earlier the possibility that some manufacturers initially might decide to move some things in-house. Do you have any examples of that in your business?

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Steve Case, RIP

Our deepest sympathies to the friends and family of CyberOptics founder Steve Case, who died in a plane crash Tuesday.

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Features

Cell Efficiency is Key to Success of Photovoltaics
The iNEMI Roadmap spells out the plan for lowest cost per watt.
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BGA Reballing Reliability
A study of multiple reball processes looks at copper dissolution and functionality.
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Products

Young Jin Features Link Conveyors
Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has...

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