January 2009 Issue Print E-mail
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Wednesday, 31 December 2008 19:00
January 2009 cover
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FEATURES

  • The Hidden Factory
    Eliminating Muda: One Company’s Journey
    When the Milwaukee Electronics Companies decided to implement Lean manufacturing principles in 2003, its implementation team thought the major benefit would be increased throughput on the manufacturing floor. While those goals were achieved, the most significant lesson learned was the true bottleneck lay in supply-chain management.
    By Don Sivilotti

  • Cover Story
    Selective Wave Soldering DoE to Develop DfM Guidelines for Lead and Pb-Free Assemblies
    The reduced pallet opening size on a selective wave solder pallet hampers the ability to successfully fill PTH barrels, a problem amplified when using Pb-free alloy due to differences in fluid properties. An intensive DoE finds several ways to quantify the impact of design, component spacing and hole-fill criteria in terms of DPMO.
    By Makram Boulos, Craig Hamilton, Mario Moreno, Ramon Mendez, German Soto and Jessica Herrera

  • Test Developments
    Overcoming Limited Access at ICT
    A new novel technology delivers in-circuit test stimulus signals via a boundary scan device, a method said to reduce the number of ICT probes needed to test all the board components – and the ICT system cost, too.
    By Jun Balangue

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On the cover: A DoE offers optimized solder pallet designs for selective soldering. (Photo courtesy Celestica)


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Last Updated on Tuesday, 05 May 2009 06:08
 

Columns

RoHS's Side Benefits

I have mentioned numerous times that the first purpose of RoHS is to help make recycling easier. So RoHS was developed to support WEEE. One would imagine that, in doing this, the EU was primarily concerned with recycling in the EU.

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2001 vs. 2009: Why Semis Did Better This Time

The Great Recession that began in the fourth quarter of 2008, at the height of the holiday spending season, had an enormous effect on world economies in 2009. The bursting of the bubble housing market in the US resulted in the meltdown of financial institutions around the world.

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Features

Capacitor Testing Challenges and Solutions

Chip caps are prone to leakage, so consider these test methods for minimizing electrical failures.

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5 Issues Driving the Cost of Poor Quality

Why common metrics fail to root out the causes, and actually add cost in the process.

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Fujiploy Offers Sarcon GR-Tac
Sarcon GR-Tac is a 0.25-mm thick polyester reinforced thermal interface material.  Is reportedly easy to install and typically does not require adhesive; ideal for applications where surface space...

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