March 2006 Issue Print E-mail
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Tuesday, 28 February 2006 19:00

March 2006 cover

FEATURES

  • Cover Story
    Cleaning Up after Pb-Free
    Lacking field data for no-clean Pb-free solders and confidence in accelerated aging tests? An expected increase in contaminants means effective cleaning is the only way to guarantee an assembly won't fail due to residues.
    Leigh Jansen

  • Process Management
    Concurrent Manufacturing in an EMS Environment
    The changes and precautions to take down the line during implementation of Pb-free manufacturing. This review covers printing, placement, soldering, inspection, materials management, compatibility and marking.
    Amey Teredesai and Tony Batalha

  • Soldering Materials
    Pb-Free Solder Assembly for Mixed-Technology Boards
    While assemblers push for a single alloy throughout all soldering processes to avoid cross-contamination, tests show no joint degradation related to the mixing of SN100C and SAC alloys.
    Karl Seelig

  • Wire Bonding
    Increasing Process Reliability in Fine-Pitch Wire Bonding
    A two-year study involving millions of bonds on LQFPs and BGAs identifies close ties between the performance of the wire bonder capillary and subsequent failures.
    Yair Alcobi

FIRST PERSON

MONEY MATTERS

TECH TALK

DEPARTMENTS

Industry News
Market Watch
Assembly Insider
Nepcon China and SMT/Hybrid/Packaging Product Preview
Ad Index
Classifieds

On the cover: Due to a lack of Pb-free aging data, cleaning may make a comeback. (Cover photo courtesy Humiseal/Chase Specialty Coatings.)


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Last Updated on Tuesday, 07 February 2012 09:45
 

Columns

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Products

Alpha Introduces Lumet LED Materials
Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board...