March 2007 CA TOC

FEATURES

• INEMI Roadmap
  Converging Products, Expanding Supply Chain
  The “iNEMI Roadmap 2007” edition, available this month, provides a more global perspective than any previous version, with representation from all major regions. Here, future research, development and implementation needs are identified.
  Jim McElroy

• Wave Solder Fluxes
  Wave Soldering Flux Selection for Pb-Free Assembly
  Both the manufacturing and end-use environments play big roles in flux selection. A look at the design, process and reliability implications of each major type of flux.
  Chrys Shea, Sanju Arora and Steve Brown

• Lean Manufacturing
  Effective Lean Six Sigma Deployment in a Global EMS Environment
  The fusion of Lean Six Sigma has achieved results more effectively and efficiently than either quality program does alone. Here’s how to avoid the most frequent cause of failure: putting it into practice.
  Dr. Harjinder Ladhar

• Cover Story
  Quickturn BGA Reballing
  A new, quickturn technique for reinstalling balls on “BGA” components relies on laser-cut polyimide stencils and fixtures, and is designed to place new solder balls onto array-style components in small volumes (fewer than 100 devices).
  Bob Wettermann

FIRST PERSON

• Caveat Lector
  Machine software is the next big thing.
  Mike Buetow

MONEY MATTERS

• Focus on Business
  The post-RoHS EMS world.
  Susan Mucha

• Global Sourcing
  Go Mexico, instead of China.
  Steven A. Colantuoni

TECH TALK

• On the Forefront
  What’s in your phone?
  E. Jan Vardaman

• Screen Printing
  All fueled up.
  Clive Ashmore

• Better Manufacturing
  The under-discussed threat of copper dissolution.
  Peter Grundy

• Tech Tips
  Flip chip RF vs. wirebonding.
  American Competitiveness Institute

• Wave Soldering
  Solder bridging corrective actions.
  Gert Schouten

• Test and Inspection
  Keeping up with new packages.
  Stacy Kalisz Johnson

• Process Doctor
  Control the process, or just test it?
  Terry Munson

• RoHS Revisited
  Watered down.
  John Burke

• Pb-Free Lessons Learned
  Placement horror stories.
  Chrys Shea

• Materials World
  Effects of surface finishes on joint voiding.
  Dr. Renzhe Zhao

• Equipment Advances
  Viscom’s combination AOI/x-ray.

• Technical Abstracts

DEPARTMENTS

Industry News
Market Watch
Assembly Insider
Ad Index
SMT/Hybrid/Packaging and Nepcon China Product Previews

On the cover: Balls are re-soldered onto a grid array. (Photo courtesy Cookson BEST)