October 2007 Issue Print E-mail
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Sunday, 30 September 2007 19:00

October 2007 cover

FEATURES

  • Packaging Roadmap
    R&D Needs for Packaging
    Two areas of research that have evolved quickly during the last two years are SiP and 3-D packaging. The iNEMI Roadmap highlights the approaches and clarifies industry needs.
    Joe Adam

  • SEAs 2007
    The Learning Organization
    Key Electronics’ never-ending pursuit of improvements has boosted it to consecutive Service Excellence Awards.
    Chelsey Drysdale

  • Cover Story
    A Study of 0201s and Tombstoning in Pb-Free Systems
    Tombstoning is reported to occur more frequently in Pb-free systems, and smaller components are at greater risk than larger ones. A comprehensive DoE finds paste and placement offsets to be the top contributor to defects.
    Paul Neathway, Andrew Butterfield, Quyen Chu, Nick Tokotch, Robert Haddick, Jean-Marc Peallat, Chrys Shea and Prashant Chouta

  • Soldering Materials
    BGA Assembly with Low-Ag Alloy Spheres
    It is possible – under certain process and assembly conditions. However, assemblers must be aware of the impending change, best communicated through a part number change.
    Girish Wable and Paul Neathway

  • Selective Soldering
    Selective Soldering for High-Volume Assembly
    In an EMS environment, selective soldering, using a nozzle pattern, eliminated masking, excessive flux and pallet washing. Solder splashes were eliminated, and overall quality improved drastically.
    Frank Grimard

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On the cover: Tombstoning is an omen for process engineers. (Photos courtesy Jabil)

Last Updated on Saturday, 13 October 2012 08:16
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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Products

Techspray Introduces Fine-L-Kote High Viscosity AR Conformal Coating
Fine-L-Kote high viscosity AR acrylic conformal coating reportedly widens the process window and flexibility. Can use as-is for dipping or thin down for spray systems. Is for selective spray systems...