April 2008 Issue Print E-mail
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Monday, 31 March 2008 19:00
April 2008 cover

FEATURES

  • Component Packaging
    Design and Modeling of High-Speed, High-Density 3-D CSPs and Memory Modules
    DDR2 pushed memory clock frequencies to 400 MHz and data rates to 800 Mbps. DDR3 further pushes clock frequencies to 800 MHz, while DDR4 is up to 1.6 GHz. New packaging technologies such as die stacking and package-on-package (PoP) are being developed to accommodate the advances.
    By Dr. Frank Y. Yuan and Richard Crisp

  • Benchtop Cleaning
    The ‘Big Brush Off’ Revisited
    In rework and repair, if you can’t rinse, you can’t clean. A prescription for cleaning a board after hand-soldering.
    By Mike Jones

  • Cover Story
    Impact of Soldering Atmosphere on Solder Joint Formation
    This collaborative effort between Flextronics and Vitronics Soltec investigated different techniques that can significantly reduce nitrogen consumption without affecting final assembly quality. Alternative nitrogen supply methods were studied, such as applying nitrogen only on the reflow areas in combination with different oxygen ppm levels during reflow process and their impact on the secondary wave soldering process of copper OSP PCBs.
    By Ursula Marquez de Tino, Dr. Denis Barbini and Wesley Enroth

  • Packaging Developments
    Beyond Moore’s Law
    Evolving 3-D system-in-packaging architectures require advanced co-design tools linked with modeling and simulation capability to facilitate effective collaboration between system, device and packaging engineers, and new materials that meet environmental requirements. But as an integrator of components and technologies from different areas, SiP is positioned to become a primary architecture.
    By Dr. W.R. Bottoms

  • Protecting Parts
    ESD Control For Class 0 ESDS Devices
    A summary of problems associated with protecting state-of-the-art devices with standard ESD controls, and specific controls necessary for reliable protection for devices sensitive between 20 and 100V.
    By Roger Peirce

  • Program Management
    Growing Your Brand
    For nearly three decades, Sue Mucha has led EMS marketing teams at companies large and small, public and private. Now the Circuits Assembly columnist has written about her experiences prepping EMS teams on growth strategies in a new book.
    By Mike Buetow

  • ESD Standards
    This Year’s Model
    ESD qualification methods for ICs have a history requiring performance to human-body-model levels of 2kV, and in some cases 200V for machine model levels. New investigations on target levels establish more realistic levels for HBM and MM.
    By Dr. Charvaka Duvvury and Dr. Harald Gossner

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On the cover: Flux chemistry can dramatically affect solder joint results. (Photo by Mariano Ruiz)

Last Updated on Wednesday, 30 April 2008 07:40
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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