May 2008 Issue Print E-mail
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Wednesday, 30 April 2008 07:35
May 2008 cover

FEATURES

  • Quality Control
    Eliminating Board Defects
    Quality product starts with DfA and the master drawing. But fabricators and assemblers have their place, too.
    By Zulki Khan

  • SEA and NPI Awards
    ‘Inspiration to Innovate’
    The 2008 edition of Circuits Assembly’s Service Excellence Awards was notable for the continuing dominance of Aegis as it was for the ascent of several previously under-the-radar EMS companies who made their mark for the first time. Plus: The NPI Award makes its debut.
    By Chelsey Drysdale

  • Cover Story
    Evaluating Manufacturability and Operational Costs for New Conformal Coating Processes
    Higher density components and smaller footprint layouts make the conformal coating process more challenging in terms of achieving acceptable first-pass process yields and cost-effective cycle times. This study of seven assembly process variables identified the three most critical variables and their impacts.
    By Jason Keeping

FIRST PERSON

MONEY MATTERS

TECH TALK

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Assembly Insider
Ad Index

On the cover: Novel test procedures and processes demonstrate that comparisons among various cleaning agents, masking materials, coating materials and application equipment can be made. (Photo courtesy Asymtek)


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Last Updated on Monday, 02 June 2008 09:51
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

EMS Introduces 535-18M-57 UV Cure Adhesive
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....