| SEHO’s Go Soldering Line |
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| Written by Administrator | |||
| Sunday, 31 August 2008 19:00 | |||
The GoReflow 1.8 and GoReflow 2.3 automatic reflow soldering ovens have five and seven heating zones, respectively, and heating zone lengths of 72.8" and 92.5", respectively, and are suited for small-to-medium-sized production. Designed for soldering in ambient atmosphere, the systems afford a high volume of circulated process gas, generated with axial fans, and adapted slot nozzles to ensure homogeneous heat distribution over the complete transport width. The heat transfer rate to the assemblies permits lower oven set temperatures. To reduce maintenance, a flux management system with stainless steel filter is integrated in the peak and cooling area. Flux residues are collected in a PE bottle, making disposal easy and environmentally friendly. Conveyor options include belt, chain with or without center-board support, or a combination of belt and chain. Comes with up-to-date control unit for quick programming and may be integrated into a fully automated production line. The GoSelective light selective soldering machine is compact and designed for standalone operation with manual infeed and outfeed of assemblies. During the process, the assembly remains on its position, while the workstations (fluxer unit, preheater and soldering unit, which are mounted on a high-precision axis system), successively approach the solder joints. This permits flexible processing of assemblies up to 500 x 500 mm with reproducible results. Features a micro drop jet fluxer said to precisely define volumes, thus permitting a defined spray pattern with minimum overspray. Processes all conventional flux types. The preheat area comes with halogen emitters to support solvent evaporation and board preheat.  Designed for miniwave soldering processes, with a variety of quick-change solder nozzles, suitable for dip and drag soldering processes. Nozzle options include coated, said to be nearly maintenance-free, and uncoated, for processing extremely small grid spacings. Comes with local nitrogen inertion, control unit and a high-precision axis control. Features fiducial recognition and correction function. Programming requires only the x and y coordinates of the components to be soldered to be entered and filed. An online teach system with camera is optional. Available from SEHO, seho.de.
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Inventec Releases SnBiAg Solder Paste
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...
