August 2009 Issue Print E-mail
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Saturday, 01 August 2009 00:00

Circuits Assembly August 2009 cover

FEATURES

  • Cover Story
    Preventing MLCC Failures
    Mechanical anomalies can cause electrical failure in MLCCs. Many defects - including cracks caused by panel separation - can be uncovered by first performing acoustic imaging on unassembled parts.
    By Tom Adams

  • Reflow Profiling
    Oven Adjustment Effects on a Solder Reflow Profile
    A recipe that works for one board won't necessarily work for another board if the weight or design is significantly different. This study found that of the three oven adjustments, zone set points have the biggest effect on peak temperature and TAL.
    By Fred Dimock

  • Cover Story
    More than Just a Look
    SPI market leader Koh Young is shrugging off the recession and taking Europe head on. Circuits Assembly visits the OEM to learn why now, and to get an in-depth look at its new 3-D AOI machine.
    By Mike Buetow

FIRST PERSON

  • Caveat Lector
    The estimable legacy of iNEMI CEO Jim McElroy.
    Mike Buetow

TECH TALK

 

DEPARTMENTS

Industry News
Market Watch
Product Spotlight
Ad Index
Assembly Insider

On the Cover:An acoustic image of an MLCC containing a single void.

Last Updated on Friday, 07 August 2009 13:49
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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Products

Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...