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Written by Administrator
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Thursday, 01 October 2009 00:00 |
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 FEATURES FIRST PERSON TECH TALK - Screen Printing
Combining clamping and snugging in a single board handling method. Clive Ashmore - Reflow Soldering
Larger pads and better PCB layout will reduce strain. Ursula Marquez de Tino, Ph.D. and Brian Roggeman - Wave Soldering Troubleshooting
If solder isn’t reaching the components, check these areas. Paul Lotosky - The Defects Database
What look like open BGA joints might be tricks of the light. Dr. Davide Di Maio - Process Doctor
Chemistry cleaning trials should be conducted prior to equipment selection. Harald Wack, Ph.D. - Tech Tips
Special software permits factory floor adjustments, potentially saving capital investments. ACI Technologies Inc. - Test and Inspection
Five ICT tools for limited access testing. Andrew Tek - Solar Technologies
The two primary ways need more repeatable accuracy. Darren Brown - Technical Abstracts
In case you missed it. DEPARTMENTS Off the Shelf
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Last Updated on Friday, 20 November 2009 18:32 |