February 2010 Issue Print E-mail
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Written by Administrator   
Monday, 01 February 2010 00:00

Circuits Assembly February 2010 cover

FEATURES

  • DfA
    Component Layout in Placement Processes
    Effective, accurate component placement takes into account the best practices of design and assembly, both of them inextricably intertwined. Positioning CSPs and noise-sensitive devices are two of a host of considerations.
    by Zulki Khan

  • Component Lead Prep
    A Novel Process for Automated Lead Tinning
    Tin whisker formation associated with Sn99 finishes and other assembly solder defects are being seen by many companies due to the faster oxidation rates of Sn99 component finishes. Such parts can now be rapidly de-taped, tinned, cleaned and re-taped via new equipment and processes.
    by Richard Stadem and Cornel Cristea

  • Zestron Corp.
    Closing the Cleaning Gap
    The switch to Pb-free solders and more densely packed boards that effectively turn even trace residues from aesthetic nuisances into potential hazards has brought about a renaissance for cleaning advocates. A trip through Zestron’s tech center outside Munich reveals a company dedicated to fixing these process problems.
    by Mike Buetow

  • Soldering Optimization
    Wave Solder Thermal Profiling
    Knowing how to set the temperatures in soldering can ease the occurrence of board failures.
    by Francisco Anaya

FIRST PERSON

MONEY MATTERS

  • Global Sourcing
    When offshoring works best.
    Rob Duvall

  • ROI
    Back to basics.
    Peter Bigelow

TECH TALK


DEPARTMENTS

Off the Shelf

 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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Products

Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...