May 2010 Issue Print E-mail
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Wednesday, 19 May 2010 08:56
May 2010 cover

 

FEATURES

  • Vapor Phase Rework
High Thermal Mass, Very High Lead Count SMT Connector Rework Process
Rigorous testing found local vapor phase clearly superior to alternative processes.
by Jim Bielick, Brian Chapman, Mitchell Ferrill, Michael Fisher, Phil Isaacs, Eddie Kobeda and Theron Lewis
  • Apex Recap
New Year, New Outlook
An uptick in attendance on the floor overshadowed a lack of innovations in the booths.
By Mike Buetow and Chelsey Drysdale

FIRST PERSON

EMS hot for LED.

Mike Buetow

FHP Reps’ Keith Favre.

Mike Buetow

Sayonara, electronics engineering?

Pete Waddell

 

MONEY MATTERS

Printed electronics: process revolution?

Randall Sherman

Bad grades.

Peter Bigelow 

 TECH TALK

Inside the iPad.

E. Jan Vardaman

Post-print inspection.

Dr. Rita Mohanty

Hot solder dip: back in vogue.

Al Cable

Implementing a reflow process.

ACI Technologies Inc.

Solder flooding.

Paul Lotosky

Toward grid parity.

Darren Brown

DEPARTMENTS

Last Updated on Thursday, 10 June 2010 15:21
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

Read more...
 
Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

Read more...
 

Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

Read more...
 

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Products

EMS Introduces 535-18M-57 UV Cure Adhesive
535-18M-57 UV cured epoxy adhesive is formulated for microelectronic assembly applications. Is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive....