| Keep ‘Em Together |
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| Written by Dr. Davide Di Maio | |||
| Wednesday, 31 December 2008 19:00 | |||
Thermal shock testing can avoid plating adhesion problems.![]() ![]() Recent use of higher Tg laminates that require modification in the plating process to successfully key copper to the hole wall have been experienced. The occurrence of poor or lack of adhesion would increase under the higher soldering temperatures and moisture content typical of Pb-free assembly. It is necessary to work with the PCB supplier and examine the testing conducted for different laminate materials. Thermal shock testing on samples and microsectioning are the simplest test methods to consider as means to prove any improvement in the copper plating adhesion. Thermal shock testing is best conducted with a sand bath rather than a solder bath, as it makes the lack of copper adhesion easier to identify. In solder baths, solder can fill the plated through-hole during the test, and tends to support the copper. These are typical defects shown in the National Physical Laboratory’s interactive assembly and soldering defect database. The database (defectsdatabase.npl.co.uk), which is available to all Circuits Assembly readers, allows engineers to search and view countless defects and solutions, or submit defects online. Dr. Davide Di Maio is with the National Physical Laboratory Industry and Innovation division (npl.co.uk); This e-mail address is being protected from spambots. You need JavaScript enabled to view it .
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| Last Updated on Friday, 02 January 2009 08:10 |
Columns
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Products
GÖPEL Upgrades TOM AOI for Conformal Coatings
TOM system (Teachable Optical Measurement) inline AOI has been enhanced for inspection of conformal coating Maximum PCB size 460 x 400mm. Can be adjusted to specific test requirements. Range of...
TOM system (Teachable Optical Measurement) inline AOI has been enhanced for inspection of conformal coating Maximum PCB size 460 x 400mm. Can be adjusted to specific test requirements. Range of...




