February 2011 Print E-mail
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Friday, 07 January 2011 00:00

 

February 2011 cover

FEATURES

    DfM
    Hand to Machine
    Designs that assume hand soldering might not work for machine assembly.
    by Duane Benson

    Stencils
    How Stencil Manufacturing Methods Impact Precision and Accuracy
    Parameters that influence positional accuracy are studied on a number of laser-formed stencils.
    by Ahne Oosterhof and Stephan Schmidt

    Outsourcing
    ODM or EMS: Which is Best for Your Project?
    Outsourcing options continue to evolve, and the supplier’s choice of business model has both positive and negative cost implications. A look at the advantages and tradeoffs between two of these business models.
    by Jim Chen

    SPI
    Mining Data to Improve Stencil Printing
    A simple yet highly effective recipe for mining the mountain of diagnostic data a solder paste inspection system acquires.
    by Chrys Shea

     

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Last Updated on Wednesday, 02 March 2011 14:46
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

Alpha Introduces Lumet LED Materials
Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board...