December 2011 Print E-mail
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Monday, 09 May 2011 00:00

December 2011 cover


FEATURES

    Retrospective
    In Memoriam
    2011 will likely be recalled as a transitive year, one in which we took stock of the pros and cons of various geographies and business models as we tried to come to grips with very uncertain economic times. It will also be recalled as the year we lost some of the industry’s biggest names from all ends of the design and manufacturing spectrum, from Steve Jobs to Werner Engelmaier. This month we reflect on their impact on our industry and our lives.

    Stencils
    SMT Stencils from a Production Perspective
    The SMT stencil market is burgeoning with new materials, coatings and cutting technologies, all of which promise to improve the solder paste printing process. Which of these options really help assemblers keep yields up and costs down, and which are nothing more than techno-snake oil borne of marketing genius? An investigation took a comprehensive look at SMT stencils under volume manufacturing conditions.
    by Chrys Shea

    Automated Inspection
    Implementing Good Test Coverage and Eliminating Escapes
    Recent experiments on AOI, AXI and ICT in a production setting revealed multiple test coverages are ideal to ensure no escapes. The researchers found there is room to reduce testing coverage by studying detectable defects and testing yield, and a DPMO prediction can be made for a new assembly program.
    by Gaosen Li, An Qi Zhao, Andrew Ho, Wei Wen, Zhen (Jane) Feng, Ph. D., Murad Kurwa, Haolee Yang and Liang Chen

     

 

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Last Updated on Wednesday, 14 December 2011 13:28
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

Inventec Releases SnBiAg Solder Paste
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...