June 2012 Print E-mail
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Monday, 09 May 2011 00:00

June 2012 cover

 

FEATURES

    Underfilms
    Assembly and Reliability of Preform Underfilmed BGAs in Drop Test and Thermal Cycling
    Pb-free solders generally are inferior to Pb-free solders in drop or shock testing. Preform underfilms can provide greater BGA to PCB mechanical robustness in a fairly seamless way – attached on reels similar to passives and reflowed simultaneously with the components, with only a minor design change required. And the results are impressive.
    by Andrew Mawer, Thomas Koschmieder, Paul Galles, Randy Anding, George Skevofilax and Tim Lippe

 

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Last Updated on Wednesday, 06 June 2012 13:48
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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Products

Panasonic Debuts PanaCIM Maintenance with Augmented Reality
PanaCIM Maintenance with Augmented Reality software provides instant communication and information to factory technicians -- when and where it is needed -- so they can respond to factory needs more...