November 2004 Issue Print E-mail
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Sunday, 31 October 2004 19:00

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FEATURES

  • Virtual Manufacturing
    A Supply-Chain Engineering Solution
    Most EMS companies have seen limited success providing design-related services to OEMs. A new method known as "Virtual Cluster" proposes to bring together best-in-class companies for design project engineering and supply-chain functions, to reduce cost and time-to-market.
    Bill Coker

  • Cover Story
    Pb-Free Reflow and Rework
    While long-term reliability evals are ongoing, NEMI has found that when using optimized tools and processes carried out by experienced personnel, SnAgCu reflow forces a big hike in melt temperature. A list of findings and recommended changes for lead-free reflow and rework.
    Matt Kelly, Quyen Chu and Jasbir Bath

  • Large Format Rework
    Large Format Rework for Eutectic and Lead-Free Applications
    Meeting specific rework needs of disparate boards requires a move away from one-size-fits-all equipment. The combination of full-bottom-panel, low-mass IR heating, stationary board fixturing and gantry-type reflow can eliminate many warping problems faced when reworking large BGA boards.
    Stan Kench

  • Optical Inspection
    Lead-Free First-Article Inspection
    Smaller process windows of lead-free alloys put greater demands on soldering equipment and inspection equipment and procedures. What are the typical process concerns associated with LF alloys for first-article OI and line qualification?
    Mark Cannon

  • Data Reliability
    Manufacturing Effects on Data Retention of Nonvolatile Memory Devices
    There is negligible effect on data retention by soldering NVM devices after they have been programmed.
    Kelly Hirsch

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On the cover: An intensive collaborative investigation reveals certain parameters for lead-free rework.


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Last Updated on Tuesday, 07 February 2012 09:49
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

Alpha Introduces Lumet LED Materials
Lumet LED materials are for die attach and package, package on board, Luminaire module, power driver/supply and control systems. Lumet P33 Pb-free, no-clean solder paste for LED package-on-board...