June 2004 Issue Print E-mail
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Monday, 31 May 2004 19:00

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FEATURES

  • COVER ARTICLE
    Investigating Voids
    Does a connection exist between pad finish and voiding in lead-free assemblies?
    Keith Bryant

  • SERVICE EXCELLENCE AWARDS
    Service Wins the Game
    "The purpose of a business is to create a mutually beneficial relationship between itself and those that it serves. When it does that well, it will be around tomorrow to do it some more."
    Robin Norvell, Assistant Editor

  • FOCUS ON HDI/ADVANCED TECHNLOGY
    Flip Chip Underfill and Flux Residue with Lead Free
    This study presents data on the compatibility of 17 different flux systems with two underfill systems in a lead-free flip chip assembly process.
    Brian J. Toleno, Ph.D., and George Carson, Ph.D.

  • AOI in a High-Mix/Low-Volume Environment
    The cost savings when using AOI can pay for the system on one job under the right circumstances.
    Matthew Holzmann

EMS Supplement

PERSPECTIVES

DEPARTMENTS

Industry News
NETgain
HDI/Advanced Technology
The Fine Pitch - Q&A with Roger Savage, President, Kester
Europe Watch
Assembly Insider
Ad Index
Classifieds
SEMICON West Product Preview

Cover illustration courtesy of Dage Precision Industries, Aylesbury, UK.

Last Updated on Tuesday, 07 February 2012 09:49
 

Columns

Eastern-US: China’s New Competitor?

Parity emerges among EMS Factories from Asia, Mexico and the US.

For the first time in years we see parity in the Eastern US among EMS factories from Asia, Mexico and the US. This EMS market condition will permit American OEMs (the EMS industry refers to OEMs as customers) to have more EMS pathways to choose from. Now more than ever, such EMS assignments will require deeper investigation relating to the OEMs’ evaluation of manufacturing strategies.

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The Human Touch

For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.

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Features

Advances in Concentration Monitoring and Closed-Loop Control

Contaminated bath water skews refractive index results. New technology can accurately measure aqueous cleaning agent concentration.

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Circuits Disassembly: Materials Characterization and Failure Analysis

A systematic approach to nonconventional methods of encapsulant removal.

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Products

Techspray Introduces Fine-L-Kote High Viscosity AR Conformal Coating
Fine-L-Kote high viscosity AR acrylic conformal coating reportedly widens the process window and flexibility. Can use as-is for dipping or thin down for spray systems. Is for selective spray systems...