FEATURES

• Cover Story
  Design and Assembly of 01005 Passives Using Pb-Free Solder
  The good news: It can be done. This study of pad sizes and stencil apertures, placement, reflow and test offers a blueprint for success.
  Fredrik Mattsson, David Geiger, Dr. Dongkai Shangguan and Todd Castello

• SMD Characterization
  PBGA Package Warpage and Impact on Traditional MSL Classification for Pb-Free Assembly
  The classification criteria of J-STD-020C may need updating in light of these warpage results.
  B.T. Vaccaro, R.L. Shook, E. Thomas, J.J. Gilbert, C. Horvath, A. Dairo and G.J. Libricz

• AOI Setup Basics
  Handling Failed Product after AOI
  Common manufacturing options for handling product after AOI, and considerations for sorting and repair of inspected product.
  Gary Goldberg

• Emerging Markets
  Steps to Develop and Promote Indian EMS
  India is finding its way in the EMS world. Here’s what it still needs to do.
  Mark Zetter

• 0201 Placement
  Placement Challenges of 0201s
  Most defects are traced to placement, and 0201s compound the potential for havoc. Here’s how to overcome size and spacing issues.
  Shawn Robinson and James Lamuraglia

• Pb-Free Prototypes
  Issues in Outsourcing Pb-Free Prototypes
  Short-run producers face two types of challenges: supply-base and process. They have to figure out all the same process changes, but on a shorter time schedule.
  Elliot Shev, Brian Wycoff and Michelle Saumur

FIRST PERSON

• Caveat Lector
  In D.C., cash is still king.
  Mike Buetow

• Talking Heads
  Speedline’s Pierre de Villemejane
  Mike Buetow

MONEY MATTERS

• Focus on Business
  Aligning sales teams with business models.
  Susan Mucha

• Global Sourcing
  More inventory, more profit?
  David Wolff

TECH TALK

• On the Forefront
  RFID tag, you’re it!
  E. Jan Vardaman

• Screen Printing
  Other applications for screen printers.
  Clive Ashmore

• Better Manufacturing
  Cleaning up after Kyoto.
  Peter Grundy

• Optoelectronics Assembly
  When to outsource opto build.
  Michael Shores

• Test and Inspection
  AOI and SPI can ease the lead-free transition.
  Stig Oresjo, Thorsten Niermeyer and Stacy Johnson

• Countdown to Pb-Free
  Lead-free soldering takes a bath.
  Denis Barbini, Ph.D., and Paul Wang, Ph.D.

• Process Doctor
  Cross-sections: Still a cut above.
  Terry Munson

• Technical Abstracts

DEPARTMENTS

Industry News
Market Watch
Ad Index
Assembly Insider
Nepcon East Product Preview
Classifieds

On the cover: Placing the next generation of chips requires new feeders and better vision. (Universal Instruments Corp.)