August 2005 Issue Print E-mail
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Written by Administrator   
Sunday, 31 July 2005 19:00

August 2005 cover

FEATURES

  • AOI Pitfalls
    Poor Vision
    The value of inspection is overshadowed by software issues and floor management.
    Matt Holzmann

  • Cover Story
    Pb-Free, Moisture Sensitivity and X-Ray Inspection
    Parts absorb considerably more moisture during lead-free assembly. X-ray can spot the subsequent solder joint problems.
    David Bernard, Ph.D.

  • CAM Automation
    Not-So-Secret Codes
    Never change CAM automation on a Friday, and other lessons of software integration.
    Stephen Potter

  • Component Packaging
    MEMS in Medicine
    How these next-generation components are changing a vital application for electronics.
    Ken Gilleo, Ph.D.

  • Pb-Free Transition
    Converting Wave Soldering Equipment to Pb-Free
    Install a new solder pot in just an hour.
    Lee Whiteman, Jeff Stong and Debbie Alavezos

FIRST PERSON

MONEY MATTERS

TECH TALK

DEPARTMENTS

Assembly Insider
Industry News
Market Watch
Ad Index
ATExpo Product Preview
Nepcon Southeast China Product Preview

On the cover: X-ray's role in lead-free assembly. ( iStockphoto Inc.)


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Last Updated on Tuesday, 07 February 2012 09:47
 

Columns

European RoHS Enforcement Explained

A series of workshops next month on compliance with RoHS and other directives will help US companies looking to break into the European market.

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Believing Foxconn Means Suspending Belief

The Foxconn makeover is in full swing, with the latest this piece from the New York Times that supposes that the world's largest ODM is worried that Apple -- yes, Apple -- might be bringing it down:

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Features

Managing Your ESD Program

The processes are as important as the tools.

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SMT Reflow Oven-to-Oven Repeatability

How to adjust an oven so a single recipe will work across multiple ovens for an individual product.

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Products

Inventec Releases SnBiAg Solder Paste
Tin-bismuth-silver solder paste for SMT assembly has silver content of >1% for improved mechanical reliability and thermal cycling. Melting point is around 139°C. Offers good soldering yield for...